【公開日：2025.06.10】【最終更新日：2025.05.23】
課題データ / Project Data
課題番号 / Project Issue Number
24UT0288
利用課題名 / Title
Fatigue of Cu/Nb Metallic Layered Structures
利用した実施機関 / Support Institute
東京大学 / Tokyo Univ.
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）計測・分析/Advanced Characterization（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）その他/Others（副 / Sub）-
キーワード / Keywords
Cu/Fe metallic layers,イオンミリング/ Ion milling
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
Hu Haoyu
所属名 / Affiliation
東京大学工学系研究科マテリアル工学専攻
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
安田 光希,飯塚 大貴
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）-
利用した主な設備 / Equipment Used in This Project
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
The samples were cross-section polished for EBSD measurement.
実験 / Experimental
The samples were cross-section polished using CP(SM-09010 and SM-09020).
結果と考察 / Results and Discussion
EBSD measurement was conducted following CP. The crystallographic information was obtained for the metallic layer structures(Fig.1). CP proved to be an effective preparation method for EBSD, as it provided a high-quality surface with minimal deformation, allowing for accurate indexing of the diffraction patterns. The reduction of surface artifacts and residual stress enhanced the clarity of the acquired data, improving the reliability of grain orientation and phase identification. Compared to conventional mechanical polishing, CP resulted in better Kikuchi pattern quality, which is crucial for precise crystallographic analysis. The superior surface finish obtained through CP contributed to higher indexing rates, making it a preferred method for EBSD measurements.
図・表・数式 / Figures, Tables and Equations
Fig.1 The IPF maps of Cu/Fe metallic layers
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件